Semiconductor device and method of manufacturing the same

ABSTRACT

A semiconductor device including a semiconductor substrate having oppositely facing first and second surfaces, the first surface being an active surface and provided with an electronic element thereon, a pad electrode to be connected to the electronic element in a peripheral portion of the electronic element on the active surface, a first opening extending from the second surface toward the pad electrode so as not to reach the first surface of the semiconductor substrate, a second opening formed to reach the pad electrode from a bottom surface of the first opening and having a diameter smaller than that of the first opening, an insulating layer formed to cover sidewall surfaces of the first opening and the second opening, and a conductive layer formed, inside of the insulating layer, to cover at least an inner wall surface of the insulating layer and a bottom surface of the second opening.

RELATED APPLICATION DATA

This application is a continuation of U.S. patent application Ser. No.15/167,348, filed May 27, 2016, now U.S. Pat. No. 10,050,074, which is acontinuation of U.S. patent application Ser. No. 14/689,906 filed Apr.17, 2015, now U.S. Pat. No. 9,379,155, which is a continuation of U.S.patent application Ser. No. 14/ 199,124 filed Mar. 6, 2014, now U.S.Pat. No. 9,041,179, which is a continuation of U.S. patent applicationSer. No. 13/553,389 filed Jul. 19, 2012, which is a division of U.S.patent application Ser. No. 12/046, 637 filed on Mar. 12, 2008, now U.S.Pat. No. 8,252,628, the entireties of which are incorporated herein byreference to the extent permitted by law. The present invention claimspriority to and contains subject matter related to Japanese PatentApplication No. JP 2007-066173 filed in the Japanese Patent Office onMar. 15, 2007, the entire contents of which being incorporated herein byreference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a semiconductor device and a method ofmanufacturing the same. More particularly, the present invention relatesto a semiconductor device having a wiring which passes through asubstrate such as a semiconductor device in a packaged form in which asolid-state imaging device or the like is air-tightly sealed. Thepresent invention relates also to a method of manufacturing the same.

2. Description of Related Art

As one example of miniaturization of a solid-state image sensor, thereis disclosed a method for keeping a image sensor area in a sealed statein Japanese Unexamined Patent Application Publication No.2006-128713(hereinafter referred to as “Patent Document 1”) or the like. The methodincludes forming an adhesive layer in a peripheral portion.outside ofthe image sensor area, disposing a transparent plate such as glass abovethe solid-state image sensor to adhere the transparent plate by anadhesive layer for sealing.

A method for electrically connecting an external electrode of thesolid-state image sensor thus configured is as follows: a dry etchingmethod or the like is used to form a through hole which reaches a padelectrode made of aluminum or the like disposed on an active surfacefrom a surface opposite to the active surface of the solid-state imagesensor; an inner wall of the through hole is formed with an insulatinglayer for ensuring insulation from a silicon substrate constituting thesolid-state image sensor; and a conductive layer, made of copper or thelike, for electrically connecting with the pad electrode filled withinthe through hole or deposited to cover a side wall of the through hole.

When the external electrode is electrically connected from a rearsurface of the active surface, it may become possible to achievepackaging of a solid-state imaging device by the same size as that ofthe solid-state image sensor, thereby enabling miniaturization of thesolid-state imaging device.

SUMMARY OF THE INVENTION

However, in the semiconductor device of the Patent Document 1, thesilicon substrate and the conductive layer filled within the throughhole or deposited to cover the side wall of the through hole have adifference in thermal expansion coefficient. Thus, there arises an issuein that due to a thermal process such as that for solidification of aresin applied after the formation of the conductive layer, a reflow of asolder or the like, crack occurs on a silicon substrate side from abottom which reaches the pad electrode of the through hole and an areanear a corner of the side wall.

Further, there is another issue in that due to thermal expansionresulting from the thermal process of the conductive layer, the aluminumor the like of the pad electrode is pushed upwardly, thereby causingpeeling on an interface between the conductive layer and the padelectrode, or peeling of the pad electrode and the adhesive layer.

An issue to be solved is difficulty in inhibiting the crack or thepeeling caused due to a difference in thermal expansion coefficientbetween the conductive layer filled within the through hole and thesubstrate or the pad electrode.

In accordance with an aspect of the present invention, there is provideda semiconductor device of including: a semiconductor substrate havingfirst and second surfaces opposite each other, the first surface beingan active surface by provided with an electronic element thereon; anactive surface formed with an electronic element; a pad electrode formedto be connected to the electronic element in a peripheral portion of theelectronic element on the active surface; a first opening extending fromthe second surface of the semiconductor substrate toward the padelectrode so as not to reach the first surface of the semiconductorsubstrate; a second opening, formed to reach the pad electrode from abottom surface of the first opening, having a diameter smaller than thatof the first opening; an insulating layer formed to cover sidewallsurfaces of the first opening and the second opening; and a conductivelayer formed, inside of the insulating layer, to cover at least an innerwall surface of the insulating layer and a bottom surface of the secondopening.

In the above-described semiconductor device, the electronic element isformed on the first surface which is the active surface of thesemiconductor substrate, and the pad electrode is formed to be connectedto the electronic element in the peripheral portion of the electronicelement on the active surface. Herein, the first opening extends fromthe second surface of the semiconductor substrate toward the padelectrode so as not to reach the first surface of the semiconductorsubstrate, and the second opening, having a diameter smaller than thatof the first opening, is formed to reach the pad electrode from thebottom surface of the first opening. The insulating layer is formed tocover sidewall surfaces of the first opening and the second opening. Theconductive layer is formed to cover at least the inner wall surface ofthe insulating layer and the bottom surface of the second opening,inside of the insulating layer.

In accordance with another aspect of the present invention, there isprovided a method of manufacturing a semiconductor device including thesteps of: providing a semiconductor substrate having first and secondsurfaces opposite each other; forming an electronic element on the firstsurface which is an active surface of a semiconductor substrate andforming a pad electrode to be connected to the electronic element in aperipheral portion of the electronic element on the active surface;foaming a first opening to extend from the second surface of thesemiconductor substrate toward the pad electrode so as not to reach thefirst surface of the semiconductor substrate; forming a second openinghaving a diameter smaller than that of the first opening to reach thepad electrode from a bottom surface of the first opening; coveringsidewall surfaces of the first opening and the second opening to foam aninsulating layer; and covering, inside of the insulating layer, at leastan inner wall surface of the insulating layer and a bottom surface ofthe second opening to foam a conductive layer.

In the above-described method of manufacturing a semiconductor device,the electronic element is formed on the first surface of thesemiconductor substrate, and the pad electrode is formed to be connectedto the electronic element in the peripheral portion of the electronicelement on the active surface.

Subsequently, the first opening is formed to extend from the secondsurface of the semiconductor substrate toward the pad electrode so asnot to reach the first surface of the semiconductor substrate, and thesecond opening, having a diameter smaller than that of the firstopening, is formed to reach the pad electrode from the bottom surface ofthe first opening.

Thereafter, the sidewall surfaces of the first opening and the secondopening are covered to foam the insulating layer, and inside of theinsulating layer, at least the inner wall surface of the insulatinglayer and the bottom surface of the second opening are covered to foamthe conductive layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic cross-sectional view of a semiconductor deviceaccording to a first embodiment of the present invention, and FIG. 1B isan enlarged view of essential parts of FIG. 1A;

FIG. 2 is a schematic diagram for describing a size of each part of thesemiconductor device according to the first embodiment of the presentinvention;

FIGS. 3A and 3B are cross-sectional views each showing a manufacturingstep of a method of manufacturing the semiconductor device according tothe first embodiment of the present invention;

FIGS. 4A and 4B are cross-sectional views each showing the manufacturingstep of the method of manufacturing the semiconductor device accordingto the first embodiment of the present invention;

FIGS. 5A and 5B are cross-sectional views each showing the manufacturingstep of the method of manufacturing the semiconductor device accordingto the first embodiment of the present invention;

FIGS. 6A and 6B are cross-sectional views each showing the manufacturingstep of the method of manufacturing the semiconductor device accordingto the first embodiment of the present invention;

FIGS. 7A and 7B are cross-sectional views each showing the manufacturingstep of the method of manufacturing the semiconductor device accordingto the first embodiment of the present invention;

FIGS. 8A and 8B are cross-sectional views each showing the manufacturingstep of the method of manufacturing the semiconductor device accordingto the first embodiment of the present invention;

FIG. 9A is a layout chart showing a scratching by the probe and anopening region of a second opening in a pad electrode of thesemiconductor of the first embodiment of the present invention, and FIG.9B is a layout chart of a first opening and the second opening relativeto the pad electrode; and

FIG. 10 is a schematic cross-sectional view of a semiconductor deviceaccording to a second embodiment of the present invention.

DETALIED DESCRIPTION OF EMBODIMETNS

With reference to drawings, embodiments of a semiconductor device of thepresent invention and a method of manufacturing the same will bedescribed.

First Embodiment

FIG. 1A is a schematic cross-sectional view of a semiconductor deviceaccording to the embodiment, and FIG. 1B is an enlarged view ofessential parts of FIG. 1A.

The semiconductor device according to an embodiment of the presentinvention is configured such that on a semiconductor chip having asolid-state image sensor such as a CMOS image sensor, the solid-stateimage sensor is air-tightly sealed, whereby a package foam is realized.

A semiconductor substrate 10 has a first surface and a second surfaceopposite each other. For example, on the first surface which is anactive surface of a semiconductor substrate 10 formed of silicon, asolid-state image sensor 11 such as a CMOS image sensor is formed.

Further, for example, on the active surface of the semiconductorsubstrate 10, in a peripheral portion of the solid-state image sensor11, a pad electrode 12 is formed to be connected with the solid-stateimage sensor 11.

For example, the second surface which is an opposite to the activesurface of the semiconductor substrate 10, a package substrate 14 formedof a transparent substrate such as glass is disposed. In a gap formedbetween the peripheral portion of the solid-state image sensor 11 an thesemiconductor substrate 10 and the package substrate 14, a sealing resinlayer 13 is formed, whereby the solid-state image sensor 11 isair-tightly sealed.

For example, a first opening H1 is formed to extend from the secondsurface of the semiconductor substrate 10 toward the pad electrode 12 soas not to reach the first surface of the semiconductor substrate 10, anda second opening H2, having a diameter smaller than that of the firstopening H1, is formed to reach the pad electrode 12 from a bottomsurface of the first opening H1.

For example, an insulating layer 20, formed of silicon oxide or thelike, is formed to cover sidewall surfaces of the first opening H1 andthe second opening H2. Inside of the insulating layer 20, a conductivelayer 21, formed of copper or the like, is formed to cover at least aninner wall surface of the insulting layer 20 and a bottom surface of thesecond opening H2 is formed.

The insulting layer 20 is a layer for avoiding a short-circuit betweenthe semiconductor substrate 10 and the conductive layer 21. Theinsulating layer 20 and the conductive layer 21 are pulled externally ofthe opening on the surface on the side opposite to the active surface ofthe semiconductor substrate 10, and function as lead electrodes.

A passivation film 22, which is a solder resist or the like, is formedto cover the surface on the side opposite to the active surface of thesemiconductor substrate 10. An opening for exposing a part of theconductive layer 21 is provided on the passivation film 22, and a bump23 such as a soldering ball bump and a gold stud bump is formed therein.

As described above, the semiconductor device according to an embodimentof the present invention is configured.

The semiconductor device according to an embodiment of the presentinvention is used, for example, by being mounted via the bump 23 on amount substrate or the like, or being mounted in another substrateformed with a memory element or the like to be used in a module.

FIG. 2 is a schematic diagram for describing a size of each part of thesemiconductor device according to an embodiment of the presentinvention.

In the semiconductor device described above, a diameter a2 of the secondopening H2 preferably is 0.7 or less times a diameter a1 of the firstopening H1, and more preferably 0.5 times or less.

As explained in a manufacturing method described later, it may bepossible to increase a degree of freedom of an alignment of the secondopening H2 relative to the pad electrode 12.

Further, a depth b1 of the first opening H1 preferably is 0.5 times ormore and 0.9 times or less a thickness B of the semiconductor substrate10.

If the depth b1 of the first opening H1 is less than 0.5 times thethickness B of the semiconductor substrate 10, an aspect ratio of thesecond opening H2 becomes too large. Thus, it may become difficult toperform opening of the second opening H2, an embedding step in theconductive layer or the like. As a result, there is a possibility that aTAT (Turn Around Time) becomes long. Alternatively, when the depth b1exceeds 0.9 times, a thickness of the semiconductor substrate 10 in aportion where the second opening H2 is formed becomes too thin. Thus, itmay become more probable that a trouble occurs at the time of theformation of the second opening H2 or in a reliability cycle thereafter.

For example, when the semiconductor substrate 10 has a thickness of 200μm, the first opening H1 has a diameter a1 of 80 μm, the depth b1 is 160μm, the second opening H2 has a diameter a2 of is 30 μm, and has a depthb2 of 40 μm, a shape of a good through hole may be realized.

Further, in the insulating layer 20, a thickness c1 of a portion whichcovers the sidewall surface of the first opening H1 preferably isthicker than a thickness c2 of that which covers the sidewall surface ofthe second opening H2.

When the thickness c1 of the insulting layer in a portion of the firstopening H1 having a large diameter is rendered thick and that of theinsulting layer 20 in a portion of the second opening H2 is renderedthin, a parasitic capacitance between the conductive layer and thesemiconductor substrate 10 is decreased. As a result, it may be possibleto achieve a less power consumption of the semiconductor device, and toperform a good embedding in a conductive material in a portion of thesecond opening H2 having a small diameter.

The insulating layer 20 preferably is formed of one insulating materialsuch as oxide silicon, but may be formed of a plurality of materials.

For example, when a whole of the insulating layer 20 is formed of theoxide silicon, as described in a manufacturing method later, thesidewall surface of the first opening H1 and that of the second openingH2 are covered to form an oxide silicon film, and thereafter, a portionof the sidewall surface of the second opening H2 is removed to renderthick the insulating layer of a portion of the first opening H1 whilefoaming the oxide silicon film again in the portion of the sidewallsurface of the second opening H2, whereby the thus configured insulatinglayer may be formed.

In the configuration in which a conductive layer is formed on an innerwall of an opening extending through a substrate, which is an issue inthe developing technologies, it is effective to render a diameter of theconductive layer as small as possible to prevent crack or peeling. Forexample, it may be possible to consider to simply reduce a size of thediameter of the through hole, but in this case, workability of thethrough hole becomes poor, and thus, it may become very difficult tofoam an opening which reaches the pad electrode. Further, when the sizeof the diameter of the through hole is reduced, an embedding performanceof a conductor at the time of the formation of the conductive layerbecomes poor, and thus, it may become very difficult to form theconductive layer.

It may be considered that the diameter of the through hole is kept thesame as in the developing technologies, a thickness of the oxide siliconfilm formed on the wall surface is rendered thick, and the size of thediameter of the conductive layer is reduced. However, in this case,again, a diameter of a space in which the conductive layer is formedbecomes small, and thus, the embedding performance of the conductorbecomes poor. As a result, it may become very difficult to form theconductive layer.

According to the semiconductor device of an embodiment of the presentinvention, a through hole is formed of the first opening and the secondopening smaller in diameter than the first opening. Thus, it may preventcrack or peeling occurred due to a difference in thermal expansioncoefficient between the conductive layer filled within the through holeand the substrate or the pad electrode.

In addition, a portion small in diameter is the second opening only, andthus, the formation of the through hole is facilitated. Further, theembedding performance of the conductor in the through hole is realizedwithout causing deterioration.

With reference to FIG. 3 to FIG. 8, the method of manufacturing thesemiconductor device of the above-described embodiments of the presentinvention is described.

Firstly, as shown in FIG. 3A, the solid-state image sensor 11 such as aCMOS image sensor is formed on the active surface of the semiconductorsubstrate 10 formed of silicon or the like, for example, and then thepad electrode 12 is formed to be connected to the solid-state imagesensor 11 in a peripheral portion of the solid-state image sensor 11 onthe active surface of the semiconductor substrate 10.

Subsequently, as shown in FIG. 3B, for example, a photosensitive resinlayer is coated by a spin coat method or the like, a resin in a regionwhich covers the pad electrode 12 is remained in the peripheral portionof the solid-state image sensor 11 an the semiconductor substrate 10,and exposure and development are performed such that the resin in theregion of the solid-state image sensor 11 is removed, whereby thesealing resin layer 13 is formed in the peripheral portion of thesolid-state image sensor 11 an the semiconductor substrate 10.

The region covered with the sealing resin layer 13 is pertinent to anadhesion strength with a package substrate bonded in a subsequent step,and thus, it may be necessary to appropriately select an optimal value.Preferably, the region is larger than a width of the pad electrode 12and there should be an interval of 10 μm or more inwardly from theregion in which the sealing resin layer 13 is to be removed. When theregion is formed exactly to the region in which the sealing resin layeris to be removed, a defective condition may be encountered in the casewhere the sealing resin squeezes out in the subsequent step for bondingthe package substrate.

Subsequently, as shown in FIG. 4A, for example, the package substrate 14formed of a transparent substrate such as glass is disposed an thesealing resin layer 13 in a manner to face the active surface of thesemiconductor substrate 10, and the solid-state imag sensor 11 isair-tightly sealed by the package substrate 14 and the sealing resinlayer 13.

The sealing resin layer 13 is configured such that a portion forcovering the pad electrode 12 and that for air-tightly sealing thepackage substrate 14 formed of the transparent substrate such as glassare formed of a single sealing resin layer. However, the sealing resinlayer may be formed of a plurality of sealing resin materials.

FIG. 48 is an enlarged view of essential parts of FIG. 4A, and stepsthat follow are described by the enlarged view.

Subsequently, as shown in FIG. SA, for example, on a surface on a sideopposite to the active surface of the semiconductor substrate 10, aresist film (not shown) of a pattern which opens the first opening isformed by a photolithography step, and an anisotropic dry etchingprocess such as RIE (reactive ion etching) is applied to form the firstopening H1 which extend from the second surface of the semiconductorsubstrate 10 toward the pad electrode 12.

Herein, a depth of the first opening H1 preferably is 0.5 times or moreand 0.9 times or less a thickness of the semiconductor substrate 10.

Subsequently, as shown in FIG. 58, by a CVD (chemical vapor deposition)method, for example, the sidewall surface of the first opening H1 andthe bottom surface thereof are covered to deposit oxide silicon ofseveral 100 nm to several μmin film thickness, whereby the insulatinglayer 20 is formed.

Subsequently, as shown in FIG. 6A, a resist film (not shown) of apattern which opens a bottom surface portion of the first opening isformed by a photolithography step, for example, and the anisotropic dryetching process such as RIE is applied to remove the insulating layer inthe bottom surface portion of the first opening H1.

Subsequently, as shown in FIG. 68, for example, a fourth harmonicfrequency (266 nm) of a YAG laser or a laser beam such as an ArF excimerlaser is irradiated to foam the second opening H2 smaller in diameterthan the first opening H1 to reach the pad electrode 12 from the bottomsurface of the first opening H1.

For example, the use of the fourth harmonic frequency (266 nm) of theYAG laser may permit the formation of an opening of which diameter is 10μm or less.

Herein, a diameter of the second opening H2 preferably is 0.7 times orless that of the first opening H1, and more preferably is 0.5 times orless.

Judging from a preferable range of the depth of the first opening H1, apreferable range of the depth of the second opening preferably is 0.1times or more as large as a thickness of the semiconductor substrate 10and 0.5 times or less as small as that. In particular, there is aprocessing variation of 3% to 5% within a wafer surface in an openingstep of the first opening H1, and therefore, in the case where thethickness of the semiconductor substrate is 200 μm, for example, amargin of about 10 μm may be necessary, and thus, the depth of thesecond opening H2 preferably is 10 μm or more.

Subsequently, as shown in FIG. 7A, according to a CVD method, forexample, an oxide silicon film is formed in the portion of the sidewallsurface of the second opening H2 to form the insulating layer 20, andthe insulating layer 20 is rendered thick in film in the portion of thefirst opening H1.

As a result of the above-described steps, it may become possible tofour, as the insulating layer 20, a portion which covers the sidewallsurface of the first opening H1 is rendered thicker than that whichcovers the sidewall surface of the second opening H2.

Thereafter, as shown in FIG. 7B, for example, at least the inner wallsurface of the insulating layer 20 and the bottom surface of the secondopening H2 are covered inside of the insulating layer 20 by theformation of a seed layer formed of copper by sputtering and a copperelectrolytic plating process or the like, whereby the conductive layer21 formed of copper is formed.

Subsequently, as shown in FIG. 8A, a resist film (not shown) of apredetermined pattern is formed by a photolithography step, for example,and through the anisotropic dry etching process such as RIE, theconductive layer 21 and the insulating layer 20 are patterned to form alead electrode which is lead out the opening on the surface on the sideopposite to the active surface of the semiconductor substrate 10.

Subsequently, the surface on the side opposite to the active surface ofthe semiconductor substrate 10 is covered to embed within the firstopening H1 and the second opening H2, whereby the passivation film 22such as a solder resist is formed. The passivation film 22 is formedwith an opening for exposing the conductive layer 21 in a bump formationregion.

With respect to the passivation film, a portion for embedding within thefirst opening H1 and the second opening H2 and that for covering thesurface an the side opposite to the active surface of the semiconductorsubstrate 10 are formed by an identical insulating material, but may beformed by insulating materials different to each other.

Subsequently, as shown in FIG. 8B, a bump 23 such as a solder ball bump,a gold stud bump is formed in the opening of the passivation film 22,for example.

As described above, the semiconductor device according to an embodimentof the present invention is formed.

As a step which follows the above-described steps, in the case where theabove-described steps are performed an a wafer level, a dicing processis performed the singulation.

According to the method of manufacturing the semiconductor device of anembodiment of the present invention, when the first opening and thesecond opening smaller in diameter than the first opening are formed asthe through hole, it may prevent crack or peeling generated due to adifference in thermal expansion coefficient between the conductive layerfilled within the through hole and the substrate or the pad electrode.

Recently, a less power consumption and a higher speed of thesemiconductor device are further desired, and a reduction in parasiticcapacitance of the conductive layer filled within the through hole isalso desired. With respect to a lower capacitance of the conductivelayer within the through hole, when the conductive material layer formedon the sidewall of the through hole and the insulating layer formedbetween the silicon substrates are formed thickly, it may realize theconductive material layer with a lower capacitance. In forming aninsulating material (oxide silicon, for example) for ensuring insulationfrom silicon, a CVD method or the like is generally employed to keepuniformity of the coverage. However, when in a shape of the through holeof the developing technologies of which diameter is in a tapering shape,if the insulating layer is rendered thick, an embedding property of theconductive layer is deteriorated in the vicinity of a bottom portion ofthe opening, and on the other hand, if the insulating layer is renderedthick to achieve a lower capacitance, it is time-consuming, therebyarising issue in that the TAT becomes lengthy.

In the semiconductor device of an embodiment of the present invention,however, the insulating film is formed twice, and thus, the thickness ofthe insulating film may be easily rendered thick. Further, only thefirst opening large in diameter is rendered thick, and thus, theinsulating film is formed thinly in the second opening, wherebydeterioration of the embedding property of the conductive layer can beprevented.

Alternatively, when a scratching by the probe left in the pad electrodeat the time of an inspection overlaps with the formation region of thethrough hole, a defective condition such as pad corrosion may begenerated.

FIG. 9A is a layout chart showing a scratching by the probe and anopening region of the second opening in the pad electrode. On a padelectrode P, a scratching by the probe T and the opening region of thesecond opening H2 are laid out so as not to overlap with each other.

In the method of manufacturing the semiconductor device of an embodimentof the present invention, the second opening which reaches the padelectrode is formed in practical by a laser irradiation, and thus, thesecond opening may be formed with highly precise positioning. As aresult, a misalignment may be reduced, and thereby, as shown in FIG. 9A,the through hole may be formed by keeping away from a scratching by theprobe.

Further, with respect to shrinking a size of the through hole, a bondingpad is contacted from the bottom surface of a device by forming thethrough hole, and therefore, in view of alignment precision,misalignment of the through hole or the like occurs, and thus, it maydecrease a yield of a whole of a wafer. Thus, it is difficult to achieveshrinking of a size of the bonding pad, which results in a disadvantageto miniaturization of a device size.

FIG. 9B is a layout chart showing the first opening and the secondopening relative to the pad electrode.

In the method of manufacturing the semiconductor device of an embodimentof the present invention, the second opening which reaches the padelectrode is formed practically by a laser irradiation, and thus,misalignment may be reduced. Even if the first opening H1 is misalignedrelative to the pad electrode P, as shown in FIG. 98, the second openingH2 may be precisely formed in the event that there is a certain level ofoverlapping between the first opening H1 and the pad electrode P,thereby reducing a size of the pad electrode. Therefore, miniaturizationof the device may be realized.

Second Embodiment

FIG. 10 is a cross-sectional view of a semiconductor device according toan embodiment of the present invention.

The semiconductor device according to the first embodiment is mountedvia the bump 23 on a wiring 31 on another substrate 30 formed with amemory element or the like, whereby a module is realized. For example,this is mounted on a mounting substrate for use.

In addition, the semiconductor device according to the first embodimentmay be used by being mounted on various mounting substrates andsemiconductor substrates or the like.

The semiconductor device of embodiments of an embodiment of the presentinvention is configured by a first opening and a second opening smallerin diameter than the first opening as a through hole. Thus, it maybecome possible to prevent crack or peeling generated due to adifference in coefficient of thermal expansion between a conductivelayer filled within the through hole and a substrate or a pad electrode.

A method of manufacturing a semiconductor device of an embodiment of thepresent invention, a first opening and a second opening smaller indiameter than the first opening are formed as a through hole, and thus,it may become possible to prevent crack or peeling generated due to adifference in coefficient of thermal expansion between a conductivelayer filled within the through hole and a substrate or a pad electrode.

According to the semiconductor device according to each embodiment ofthe present invention, the following advantageous effects may beenjoyed:

As described above, in the semiconductor device of the embodiments, whenthe diameter of the opening (second opening) which contacts the padelectrode is rendered small, influence of a thermal expansion of theconductive layer formed in the opening may be reduced. As a result, ahigh reliability may be achieved.

The first opening lager in diameter is formed except for a portion whichcontacts the pad electrode, and as a result, the TAT of the formation ofthe through hole may be shortened, and even a thick wafer may beapplied. Therefore, improvement of a handling ability may also beachieved.

Further, the pad electrode is contacted by the second opening smaller indiameter, and thus, a degree of freedom of position matching (alignment)of the through hole and the pad electrode is improved. As a result, thethrough hole may be formed keeping away from the scratching by the probeat the time of the inspection of a semiconductor wafer, whereby a yieldof the through hole may be improved.

In addition, when the second opening smaller in diameter is formed,miniaturization of the pad electrode also may be achieved.

The insulating layer is formed on the wall surface of the first openingmore thickly as compared to the second opening, and thus, a parasiticcapacitance between the conductive layer inside of the opening and thesemiconductor substrate may be reduced.

The present invention is not limited to the above-described description.

For example, the present invention may be applied not only to thesemiconductor device which is packaged by air-tightly sealing asolid-state imaging device such as a CMOS image sensor, but also appliedto a semiconductor device in which another electronic element isair-tightly sealed.

The present invention is not limited to a semiconductor device in a modein which the electronic element is air-tightly sealed, but as long as awiring which passes through a substrate is provided, the presentinvention may be applied.

In addition, the present invention may be modified in various ways so aslong as not to depart from a gist of the present invention.

The semiconductor device of the present invention may be applied to asemiconductor device having a wiring which passes through a substratesuch as a semiconductor device in a packaged form in which a solid-stateimaging device or the like is air-ti htly sealed.

The method of manufacturing the semiconductor device of the presentinvention may be applied to a method of manufacturing a semiconductordevice having a wiring which passes through a substrate such as asemiconductor device in a packaged form in which a solid-state imagingdevice or the like is air-tightly sealed.

1. A device comprising: a semiconductor substrate including an image sensor on a first surface of the semiconductor substrate, the semiconductor substrate including an opening at a peripheral region of the semiconductor substrate, the peripheral region being outside the image sensor; a pad electrode disposed on the first surface of the semiconductor substrate and electrically connected with the image sensor; a conductor disposed in the opening formed at the peripheral region of the semiconductor substrate and electrically connected to the pad electrode; and an insulating layer disposed in the opening and between the conductor and the semiconductor substrate, wherein, the opening includes a first portion and a second portion, an end of the second portion being defined by an end of the first portion, the second portion is closer to the pad electrode than the first portion, and a largest diameter of the second portion is smaller than a smallest diameter of the first portion.
 2. The device of claim 1, further comprising: a transparent substrate disposed over an active surface of the semiconductor substrate via an adhesive layer disposed between the transparent substrate and at least the peripheral region of the semiconductor substrate.
 3. The device of claim 2, further comprising: a passivation film covering a second surface of the semiconductor substrate opposite to the first surface, the passivation film covering the conductor and the insulating layer.
 4. The device of claim 1, wherein the transparent substrate and the adhesive layer seal the image sensor.
 5. The device of claim 1, wherein the image sensor is a solid-state image sensor.
 6. The device of claim 1, wherein the insulating layer and the conductor fill the second portion.
 7. The device of claim 1, wherein the pad electrode is on the first surface.
 8. The device of claim 6, wherein a depth of the first portion is 0.5 times or more and 0.9 times or less than a thickness of the semiconductor substrate.
 9. The device of claim 6, wherein a thickness of the conductive material in the second portion is 0.1 times or more than a thickness of the semiconductor substrate.
 10. An apparatus comprising: a package including: a semiconductor substrate including an image sensor on a first surface of the semiconductor substrate, the semiconductor substrate including an opening at a peripheral region of the semiconductor substrate, the peripheral region being outside the image sensor; a pad electrode disposed on the first surface of the semiconductor substrate and electrically connected with the image sensor; a conductor disposed in the opening formed at the peripheral region of the semiconductor substrate and electrically connected to the pad electrode; and an insulating layer disposed in the opening and between the conductor and the semiconductor substrate, wherein, the opening includes a first portion and a second portion, an end of the second portion being defined by an end of the first portion, the second portion is closer to the pad electrode than the first portion, and a largest diameter of the second portion is smaller than a smallest diameter of the first portion.
 11. The apparatus of claim 10, wherein the package further comprises: a transparent substrate disposed over an active surface of the semiconductor substrate via an adhesive layer disposed between the transparent substrate and at least a peripheral region of the semiconductor substrate.
 12. The apparatus of claim 11, wherein the package further comprises: a passivation film covering a second surface of the semiconductor substrate opposite to the first surface, the passivation film covering the conductor and the insulating layer.
 13. The apparatus of claim 10, wherein the adhesive layer seals the image sensor.
 14. The apparatus of claim 13, wherein the image sensor is a solid-state image sensor.
 15. The apparatus of claim 10, wherein the pad electrode is on the first surface.
 16. The apparatus of claim 10, wherein insulating layer and the conductor fill the second portion.
 17. The apparatus of claim 13, wherein the conductor includes an outer part extending toward an edge of the semiconductor substrate and an inner part extending toward a center of the semiconductor substrate.
 18. The apparatus of claim 17, wherein an edge of the outer part is covered by the passivation film.
 19. The apparatus of claim 17, wherein an edge of the inner part is covered by the passivation film.
 20. The apparatus of claim 10, further comprising: a bump disposed on the conductor. 